自動研磨機
電洽
自動研磨拋光機
LP061精密研磨拋光機為單工作站台式機
Ø 適用於小規模生產的研磨和拋光
Ø 能夠完成6英寸及以下尺寸樣品的處理
Ø 加工出來的樣品具有高平整度、高表面光潔度等特點
Ø 適合在半導體、光電、光學等應用領域
Ø LP061研磨/拋光的所有功能,包括盤轉速、擺臂設定、滴料速度等均可控
Ø 通過觸摸屏進行參數等控制和設定。
> LP061 precision grinding and polishing machine is a single-workstation desktop machine,
> which is suitable for grinding and polishing in small-scale production.
> It can complete the processing of samples with a size of 6 inches and below.
> The processed samples have the characteristics of high flatness and high surface finish.
> In semiconductor, optoelectronics, optics and other application fields.
All functions of LP061 grinding/polishing, including disc speed, swing arm setting, dripping speed, etc., can be controlled, and parameters can be controlled and set through the touch screen.
性能指標
機械研磨後誤差精度:
Ø 50 mm晶圓的總厚度偏差(TTV)在±1μm以內
Ø 75 mm晶圓的總厚度偏差(TTV)在±2μm以內
Ø 100 mm晶圓的總厚度偏差(TTV)在±3μm以內
機械化學拋光後誤差精度:
Ø 50 mm晶圓的總厚度偏差(TTV)在±1μm以內
Ø 75 mm晶圓的總厚度偏差(TTV)在±2μm以內
Ø 100 mm晶圓的總厚度偏差(TTV)在±3μm以內